Conductive carbon thin film formation device (arc discharge sputtering device)
Conductive carbon thin films are formed by sputtering. Stable film formation is achieved through a simple process with inert gas and carbon target at low temperatures (below 400°C).
Using the independent high-density sputtering method, conductive carbon thin films are formed through a process equivalent to metal film deposition via arc discharge magnetron sputtering (ADMS method). Compared to conventional sputtered carbon thin films, these films are characterized by significantly higher density and adhesion. Due to their conductive properties and film stability, they are suitable for new fields such as energy and biosensors. Conductive carbon thin films excel in hardness and surface smoothness, making them applicable for surface treatment of mechanical parts (tribological applications) due to their high adhesion to metals.
- Company：神港精機 東京支店
- Price：Other
